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News
Background
for Editors





Background for Editors

Key Personnel

See separate biographies page for more details


CTO

Dr. Richard Tuck

CEO

Bill Taylor

Chairman 

Professor David Simpson CBE


History and Product

The MIMIV technology spun out from basic research carried out at Aston University. Cathode Ray Tubes (CRT), as found in a typical consumer TV, have dominated the display market providing ideal viewing at low cost. However, TVs based on CRT technology are very bulky when a larger screen size (of more than 20 inches diagonal) is required.

Current large (42 inch) hang on the wall TVs are based on plasma display panel (PDP) technology on which many $ billions have been spent. However they remain expensive at around $ 3k and too expensive for most consumers. Over $1.5 billion has been spent worldwide on researching and developing prototypes of a replacement technology - field emission displays or FEDs. These offer the promise of thinner hang-on-the-wall TVs.....1cm thick and up to 2 feet wide. However companies such as Candescent, Samsung, Fujitsu, Hitachi, and Sony have only made limited progress despite their investments. This is because the first-generation cold cathode technology on which their FEDs are based (field emission displays aka flat screen large TVs) still need expensive manufacturing equipment and are difficult to scale to more than 20" diagonal.

MIMIV, however, has made a breakthrough with its second-generation cold cathode technology that will replace the cathode ray tube with a tube that is less than 1cm thick. This advancement, alongside MIMIV's development of both new materials and ultra low cost screen printing techniques, will produce a consumer priced hang on the wall 20 to 40 inch diagonal TV screen (FED).


MIMIV Intellectual Property

MIMIV holds 45 granted patents in the UK, Europe, USA, China, Korea, Japan and Taiwan, with a further 54 patents pending.


MIMIV Revenue Streams

  • Licensing its hang on the wall TV technology.
  • Supplier of the specialist materials used to build displays.
  • Designs of driver and controller ICs.